AMD今年在CES举行的更有趣的公告之一是即将发布的Zen+的发行版，Zen+是Zen平台的继任者，以及他们随附的新主板芯片组X470。让我们看一下AMD的这些大公告，看看这对第一代Ryzen和Threadripper所有者意味着什么！
小包装中的好东西？
作为一个人built a new PC around a Ryzen 7 1700X，我很清楚它的优点和缺点。大多数建筑商遇到的最大问题是RAM兼容性（和性能）以及CPU超频。我要说的一件事是：主板制造商仍在更新现有的AM4板，因此不用担心。我最近更新了板上的BIOS，这最终使我可以解锁RAM的完整3000MHz；所以我终于让我的钱值得！
amdare looking to solve these issues for good with these new CPUs, in two parts: an updated 12nm processor and a new motherboard chipset.
作为本主题的一部分，我敢肯定，你们中的许多人都对兼容性，升级等有疑问。因此，我将将信息分为这两个主要部分：有关CPU的信息，以及有关主板和芯片组更新的信息。
New CPU: Ryzen 2nd Generation (Zen+)
首先查看计划于2018年4月的CPU更新，需要提到的一件事是较小的模具。AMD在2018年竭尽全力过渡到从Zen+开始的较小模具。原始的Ryzen CPU为14nm，第二代缩小到12nm。
The first place we are going to see this is in the new 2nd-generation Ryzen CPUs in the Zen+ line, but they have also confirmed this shrinking is coming to Vega GPUs later in the year. As part of this, they’re promising higher clocks—something which is greatly needed when comparing to Intel’s single-core performance.
随着这种较小的变化，其精确提升技术的改进也可以改善。现在称为（令人震惊的）精度增强2，现在特别由CPU温度，其电流和芯片上的负载来控制。
这里的目的不仅是要根据真正的芯片性能和环境允许更快的自动增强功能，而且还允许使用更多的粒度（仅25MHz步骤），还可以在负载尖峰后更加冷却。
再加上这个更新将XFR 2, essentially where (thanks to the higher level of sensor control of the CPU) AMD’s own systems can handle the overclock more adeptly and accurately, versus a user setting a specific overclock. Again, this is much more of a quality-of-life addition, and is designed for people who want performance without the hassle of going into the BIOS and dialing in an overclock manually through trial and error.
对于第一代采用者来说，好消息是新的Zen+ CPU仍然与AM4插座兼容。但是，某些功能和改进只会出现在新芯片组上，因此让我们开始研究。
新主板：X470
您可能会问：为什么要新芯片组？好吧，其中许多更改是生活质量的更新。从本质上讲，这些是制造商在第一代版本中学到的变化！除非您传输大量数据，否则其中一些可能是您没有注意到的（例如，它们正在改善USB总线上的吞吐量）。
A lot of the changes are based around overclocking and cooling. Firstly, there’s going to be a better memory layout, allowing more compatibility with CPU coolers not smacking up against VRM shrouds, as well as hopefully meaning RAM slots are no longer blocked by wide coolers—or for those using RAM with larger heat spreaders.
另一个很大的变化是支持DDR4 RAM可用频率更高的支持。这是第一代更大的问题之一，因为Ryzen本质上是3200MHz RAM。这很可惜，因为我们可以看到CPU上的增长速度更快。早期的主板公告显示了最多4000MHz的全部支持，而CES的一些早期原型板和芯片显示它们已经在3800MHz上运行，因此，这看起来像是公告正确。
最后一个是与CPU超频有关的，这至少是第二代的“更高”。因此，多个董事会连接的延迟减少了，以及对CPU电源输送系统的更重要改进。
但是我闪亮的X350/B350主板！
正如我在CPU部分中提到的那样，新的CPU将与第一代板兼容，因为它们仍然使用AM4插座。这里的区别在于，您需要进行BIOS更新才能使此兼容。目前未知的是，这些X470板更新中的哪个将包含在上一代芯片组的BIOS更新中。毫无疑问：我们会知道这是更接近三月的！
Final Thoughts
All told, this is a very interesting time for AMD. They know they had a good 2017 with Ryzen, and they’re looking to build on that success. I’d be worried if I were Intel right now, as—based on the cooling limitations of their 8th-Generation CPUs—they’re probably close to their limit on that architecture. It will be interesting to see what Intel does next. Meanwhile, AMD is coming out swinging with significant updates. (Did I mention there’s a 2nd-generation Threadripper coming later in year off the back of this as well?)
It doesn’t end with Zen+ either. Zen 2, their 7nm processor, has been marked as ‘on schedule’ and they’re working with samples. That would potentially imply a 2019 release. Plus, as I mentioned at the top of the article, Radeon have learnt from the mistakes of Vega and are coming out not only with a smaller die for it, but Navi has now been confirmed as on-track too. So look out, NVIDIA!
但是您如何看待这个？您是否是英特尔粉丝等待英特尔的回应，AMD粉丝为AMD的发行版感到兴奋，一侧的某人或您的位置不同，或者您是中立的 - 只是希望所有比赛都意味着较低的价格和更快的筹码？在评论中让我知道！